Description

Headquartered in Incheon, South Korea, and established in 1980, HANMI Semiconductor Co., Ltd. is a global provider of advanced semiconductor manufacturing equipment, serving markets both domestically and internationally. The company's extensive product line includes specialized vision-based placement systems and a comprehensive suite of bonding solutions, such as flip chip, TSV dual stacking, TC, jumbo panel flip chip, and die flip chip bonders. HANMI also supplies comprehensive EMI shielding apparatus, encompassing vision-guided attach/detach, precise placement, tape mounting, laser cutting, demounting, and dedicated vision inspection, alongside converlay attach systems. Furthermore, their offerings extend to various testing and handling instruments like power ECU automation, test handlers, vision-enabled placement, trimming, forming, singulation, and sophisticated 3D vision inspection tools. The company manufactures diverse molding equipment, encompassing automated, compression, mechanical, and hydraulic presses. They also provide cutting-edge laser processing solutions, including general and wafer laser marking, ablation, and precise laser cutting/deflash machinery. Completing their portfolio are specialized tools such as cam press trim and form, micro cam press, CSP singulation, pick-and-place, die sorters, strip mounters, and additional testing apparatus.