Broadcom Inc. (1YD.DE) XETRA
Currency In EUR
- General
- Statistics
- Historical Data
- Profile
- Financials
Broadcom Inc.
Address
1320 Ridder Park Dr
Palo Alto, CA 94304
United States of America (the)
Phone
14084338000
Website
Sector
Technology
Industry
Semiconductors
Employees
37000
First IPO Date
October 14, 2019
Key Executives
| Name | Title | Pay | Year Born |
| Hock E. Tan | President, Chief Executive Officer & Executive Director | 2.55M | 1952 |
| Kirsten Spears | Chief Financial Officer & Chief Accounting Officer | 890,905 | 1964 |
| Mark D. Brazeal | Chief Legal & Corporate Affairs Officer | 1.22M | 1968 |
| Charlie Kawwas | President of Semiconductor Solutions | 1.82M | 1971 |
| Ji Yoo | Director of Investor Relations | 0 | N/A |
| Frank Ostojic | Senior Vice President & GM of ASIC Products Division | 0 | N/A |
| Ram Velaga | Senior Vice President & GM of Core Switching Group | 0 | N/A |
| Rich Nelson | Senior Vice President & GM of Broadband Video Group | 0 | N/A |
| Jill Turner | Vice President of Human Resources | 0 | N/A |
| Alan Davidson | Chief Information Officer | 0 | N/A |
Description
Broadcom Inc. operates as an international technology company, primarily focused on crafting, advancing, and delivering solutions in both semiconductor technology and infrastructure software. The firm's headquarters are situated in San Jose, California, where it oversees a workforce of 19,000 full-time personnel. Its operations are segmented into four key areas: Wired Infrastructure, Wireless Communications, Enterprise Storage, and an "Industrial & Other" category. Broadcom's extensive product offerings are incorporated into a wide spectrum of final consumer and industrial applications. These encompass solutions for enterprise and data center networking, home internet connectivity, television set-top boxes, telecommunications hardware, mobile phones, data center servers and storage infrastructure, automated manufacturing, conventional and renewable energy systems, and electronic displays. The scope of its portfolio ranges from individual electronic devices to sophisticated, integrated sub-systems comprising multiple component types. Furthermore, the company develops firmware specifically designed to enable communication between analog and digital systems. Its catalog also features mechanical hardware engineered for seamless interaction with optoelectronic or capacitive sensing technologies.