Description

Japan Pure Chemical Co., Ltd., established in 1971 and headquartered in Tokyo, Japan, focuses on the research, development, manufacture, and distribution of specialized metal plating chemicals, primarily serving the electronic device sector within Japan. Their comprehensive product range includes various gold electroplating solutions, such as those designed for semiconductor fabrication, printed wiring boards (PWBs), connectors, contacts, and soldering applications. The company also provides unique gold formulations, like 'strike' plating to enhance coating adhesion and 'flash' plating specifically for leadframes. Additionally, they offer palladium electroplating solutions suitable for connectors, leadframes, and decorative finishes. Beyond electroplating, Japan Pure Chemical supplies gold coatings for soldering and wire bonding, electroless palladium plating for similar uses, and a selection of silver-plating formulations, including non-cyanide immersion silver solutions for copper surfaces. To support these plating processes, the company provides complementary products such as anti-microbial agents for tank maintenance, impurity removal resins to extract copper ions from gold and palladium baths, and carbon filters engineered for use with their plating chemicals. Their portfolio is further rounded out by other surface treatment chemicals and stripping agents.