Description

Powertech Technology Inc. (PTI), together with its various subsidiaries, is a leading provider specializing in the entire lifecycle of integrated circuit (IC) products. This encompasses research, design, development, manufacturing, assembly, packaging, testing, and sales. While their primary operational base is in Taiwan, PTI maintains a significant international presence, with operations spanning Japan, Singapore, the United States, Europe, China, Hong Kong, and Macao. The company offers an extensive range of advanced packaging and testing services tailored for a diverse array of IC products. These services cover high pin-count thin small outline packages, various multi-chip packaging (MCP, S-MCP) solutions, and ball grid array (wBGA, FBGA) ICs. PTI also specializes in packaging and testing for solid-state drives (SSDs), embedded memory technologies (eMMC, eMCP, UFS), DRAM chip-stacking, mobile memory, Package on Package/in Package, CMOS image sensors, and fan-out panel level technologies. Furthermore, their capabilities extend to secured digital memory cards (SD, microSD) and USB devices. Beyond these, PTI provides sophisticated wafer-level services including Quad Flat No-leads (QFN), wafer bumping, and redistribution layer (RDL) services, as well as comprehensive wafer testing. They also deliver system-in-package (SiP), wafer-level chip scale packaging (WLCSP), flip-chip, copper pillar bump flip chip, electro-magnetic interference (EMI) shield packaging, and complete module and system packaging solutions. Complementing these core activities, the company engages in strategic investment and specialized wafer probing testing. Established in 1997, Powertech Technology Inc. is headquartered in Hsinchu City, Taiwan.