Description

Established in 1974 and headquartered in Taipei, Taiwan, Tong Hsing Electronic Industries, Ltd. specializes in the development, production, and distribution of micro modules and bespoke semiconductor packages. The company offers a broad spectrum of services, including semiconductor micro module assembly and sophisticated thick and thin film substrate foundry services, which encompass ceramic substrate fabrication. Its expertise extends to various microelectronic packaging technologies, providing solutions such as comprehensive assembly, backend processing, and essential RF testing, alongside contract manufacturing for these microelectronic components. Tong Hsing's advanced products and services are crucial across a wide array of high-tech industries and applications, including power management (IGBT, high-frequency switching power supply, telecommunication power supply), automotive, aerospace, solar energy, laser systems, high-power LEDs, microwave technology, semiconductor manufacturing equipment, hybrid electric vehicles, computer peripherals, medical devices, network infrastructure, and sensor systems.