ULVAC, Inc. (6728.T) JPX

9,185.00

+272(+3.05%)

Updated at June 03 03:30PM

Currency In JPY

ULVAC, Inc.

Address

2500 Hagisono

Chigasaki, 253-8543

Japan

Phone

81 467 89 2033

Sector

Technology

Industry

Hardware, Equipment & Parts

Employees

6234

First IPO Date

April 20, 2004

Key Executives

NameTitlePayYear Born
Setsuo IwashitaPresident, Chief Executive Officer & Director101M1953
Hirohisa TakahashiExecutive Officer, President and Chief Executive Officer of ULVAC-PHI, Inc.0N/A
Junya KiyotaHead of the Research & Development HQ and Managing Executive Officer0N/A
Harunori IwaiSenior Executive Officer0N/A
Tomoyasu KondoSenior Executive Officer0N/A
Sadao AokiSenior Managing Director, CFO, Head of Administration HQ & Director01962
Shinji TakahashiSenior Executive Officer & GM of Legal Department0N/A
Tetsuya ShimadaSenior Managing Director, Head of Prod. and CS Busi. HQ, CSO & Director01969
Takaya IwaiGeneral Manager of Management Planning Department0N/A
Ju Hoon ShinManaging Executive Officer0N/A

Description

ULVAC, Inc. engages in the development, manufacture, sale, customer support, and import/export of vacuum equipment, peripheral devices, and vacuum components and materials in Japan and internationally. The company offers various equipment, including sputtering, chemical vapor deposition, vacuum evaporation, vapor deposition polymerization, ashing, etching, ion implantation, vacuum furnaces, roll coaters, freeze drying/vacuum drying, vacuum distillation systems, and other products. It also provides components that comprise vacuum pumps, vacuum gauges, process gas monitors, leak detectors, spectroscopic ellipsometers, deposition controllers, vacuum valves, power supplies, vacuum transfer robots, molecular interaction analyzers, microplate paddle mixers, film forming equipment, refrigerators, and heat treatment and thermal properties. In addition, the company offers sputtering targets, high performance materials, and nano-metal inks, as well as deposition and etching technologies used in packaging processes; technical solutions for the production of power devices; delivering systems for SiC and Si; and solutions for micro-powder dry systems and touch screens. It serves display, solar cell, semiconductor, electronics, electrics, metals, machinery, automotive, chemical, food, and pharmaceutical industries, as well as universities and research centers. The company was incorporated in 1929 and is headquartered in Chigasaki, Japan.