Msscorps Co., Ltd. (6830.TW) TAI
Currency In TWD
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Msscorps Co., Ltd.
Address
No.178, Section 2
Hsinchu, 300046
Taiwan (Province of China)
Phone
886 3 666 3298
Website
Sector
Technology
Industry
Semiconductors
Employees
353
First IPO Date
July 27, 2021
Key Executives
| Name | Title | Pay | Year Born |
| Chi-Lun Liu | Chairman, Chief Executive Officer & President | 0 | N/A |
| Yung-Shun Liao | Senior Vice President, Chief Operating Officer & Representative Director | 0 | N/A |
| Hsueh-Liang Chou | Vice President & Chief Operating Officer | 0 | N/A |
| Jung-Chin Chen | Executive Vice President, Chief Technology Officer, Head of R&D and Representative Director | 0 | N/A |
| Wen-Hsiang Chien | VP & CISO | 0 | N/A |
| Hui-Wen Chan | Chief Accountant | 0 | N/A |
| Hsueh-Ching Mao | Head of Finance | 0 | N/A |
Description
Msscorps Co., Ltd., founded in 2005 and headquartered in Hsinchu, Taiwan, operates globally, serving markets across Asia, the Americas, and beyond. The company's primary activities include both the testing and analysis of electronic materials, alongside their design, manufacturing, and distribution via retail and wholesale channels. Msscorps provides an extensive range of specialized analytical and repair services. For material analysis, their capabilities encompass advanced techniques such as 3D laser confocal profiling, atomic force microscopy (AFM), Fourier-transform infrared spectroscopy (FTIR), X-ray photoelectron spectroscopy, and secondary ion mass spectrometry. They also utilize sophisticated equipment like cross-section polishers, SEM/EDS, plasma focused ion beams, dual beam FIB/EDS, and TEM/EDS, including liquid TEM specifically for nanomaterial assessment. Furthermore, the company offers integrated circuit (IC) circuit repair services. Msscorps conducts in-depth failure analysis, employing various methods such as transmission line pulse (TLP), THz-TDR, thermal EMMI, nano prober systems, EMMI/InGaAs, and OBIRCH. Their chemical engineering analysis services feature 2D/3D X-ray imaging, 3D optical microscopy, scanning acoustic tomography, laser decapsulation, and delayering.