Description

Huizhou CEE Technology Inc. operates globally, specializing in the comprehensive development, manufacturing, sales, and servicing of printed circuit boards (PCBs). Its extensive product portfolio encompasses various advanced PCB types, including standard rigid circuit boards (RPCBs), flexible circuit boards (FPCs), and hybrid rigid-flexible boards (RFs). They also provide high-density interconnect (HDI) solutions, including high-order and AnylayerHDIs, alongside high-layer circuit boards (HLCs) and flexible circuit board assemblies (FPCAs). These critical components are integral to a vast array of sectors and advanced applications. The company has a strong presence in burgeoning areas like network communications, cutting-edge high-definition displays, new energy vehicles, data centers, artificial intelligence (AI), the Internet of Things (IoT), big data analytics, and cloud computing. Beyond these, their PCBs find widespread utility across consumer electronics, security systems, industrial control, medical and healthcare devices, biometrics, wearables, smart home technology, and unmanned aerial vehicles (drones). Established in 2000, the company maintains its headquarters in Huizhou, China. It underwent a name change in June 2024, transitioning from its former identity as Huizhou China Eagle Electronic Technology Inc. to its current designation, Huizhou CEE Technology Inc.