Description

Operating on a global scale, ASMPT Limited functions as an investment holding company dedicated to the engineering, manufacturing, and commercialization of critical machinery, tools, and materials for the semiconductor and electronics assembly industries. The company's operations are divided into two main segments: Semiconductor Solutions and Surface Mount Technology Solutions. Its extensive product range includes equipment for deposition processes, wafer separation, automated optical inspection (AOI/FOL), die attachment, wire bonding, and material dispensing. ASMPT also supplies specialized encapsulation and CMOS Image Sensor (CIS) equipment, as well as systems for singulation, trim and form, LED testing, sorting, taping, sintering, and final test and handling. Moreover, the company offers cutting-edge solutions across various domains, such as surface mount technologies (SMT), advanced packaging, Micro-Electro-Mechanical Systems (MEMS), power management, LED/optoelectronics, photonics, Chip-on-Board (COB), and stacked die solutions, alongside smart SMT factory solutions and image sensor applications. In addition to these, ASMPT provides agency and logistics services. Founded in 1975 and headquartered in Tsing Yi, Hong Kong, the company officially rebranded from ASM Pacific Technology Limited to ASMPT Limited in June 2022.