Description

Inno Laser Technology Co., Ltd. engages in the research and development, production, and sale of lasers in the field of micromachining in China. The company also offers compact medium and low power nanosecond lasers for 3D printing, static dynamic marking, PCB/FPC cutting, glass engraving, laser trimming, etc.; integrated high power lasers for PCB/cutting an FPC, PI cover film cutting, solar cell processing, wafer processing, and mobile phone camera/fingerprint module; mobile phone antenna cutting, precision processing of brittle materials, transparent material processing, and PCB/FPC cutting and drilling applications. It provides industrial grade femtosecond lasers for use in injector drilling, machining of aerospace brittle materials, micro/nano processing, semiconductor wafer processing, interventional medical device precision machining, battery electrode micromachining, and surface microstructure modification; and MOPA nanosecond/sub-nanosecond lasers for photovoltaic chip processing, glass drilling and texturing, glass-based ink removal, PCB/FPC cutting and drilling, etc. The company's products are used in consumer electronics, new energy, 3D printing, chip manufacturing, biomedical, and other fields. It sells its products to approximately 20 countries and regions, including China, the United States, Germany, the Netherlands, Japan, South Korea, India, Singapore, etc. Inno Laser Technology Co., Ltd. was founded in 2011 and is headquartered in Shenzhen, China.