Kinsus Interconnect Technology Corp. (3189.TW) TAI

Currency In TWD

Key Executives

Name	Title	Pay	Year Born
He-Xu Chen	Chief Executive Officer & Director	0	N/A
Qian-Wei Zhang	Chief Technology Officer & Director	5.04M	N/A
Ta-Chung Chuang	Senior Vice President	0	N/A
Sih-Jheng Liao	Chairman & Deputy CSO	0	N/A
Zi-Xian Tong	Chief Strategy Officer & Director	0	1960
Su-Zhen Liu	Head of Corporate Governance, Finance & Accounting Supervisor, Senior Director of Finance Dept.	0	N/A

Name

Title

Pay

Year Born

He-Xu Chen

Chief Executive Officer & Director

N/A

Qian-Wei Zhang

Chief Technology Officer & Director

5.04M

N/A

Ta-Chung Chuang

Senior Vice President

N/A

Sih-Jheng Liao

Chairman & Deputy CSO

N/A

Zi-Xian Tong

Chief Strategy Officer & Director

1960

Su-Zhen Liu

Head of Corporate Governance, Finance & Accounting Supervisor, Senior Director of Finance Dept.

N/A

Description

Kinsus Interconnect Technology Corp., established in 2000 and headquartered in Taoyuan City, Taiwan, specializes in the production and global distribution of electronic products. The company's operations are divided into three primary segments: IC Substrate, Printed Circuit Board (PCB), and Optics. Within its IC Substrate division, Kinsus manufactures a diverse range of critical components. These include system-in-package (SiP) platforms, which serve as foundational interfaces for assembling multiple chips, packages, or passive elements within modules for mobile and wearable devices. The company also produces plastic ball grid array (PBGA) substrates, essential for microprocessors, controllers, graphic processors, ASICs, and PC chipsets. Further offerings encompass flip chip chip scale package (FCCSP) substrates, designed for application processors and connectivity solutions, and wire bond chip scale package (WBCSP) substrates, used in application processors, connectivity modules, power management units, and memory applications. Additionally, Kinsus supplies radio frequency (RF) module substrates for power amplifiers, front-end modules, and WiFi connectivity, alongside flip chip ball grid array (FCBGA) substrates tailored for high-performance micro and graphic processors, ASICs, and field-programmable gate array (FPGA) applications. Beyond these specialized substrates, Kinsus also provides various PCBs and related merchandise, as well as a selection of electronic parts and components, supported by comprehensive after-sales services. Expanding its business scope, the firm engages in a variety of other ventures. These include the wholesale and retail of electronic materials, manufacturing and selling medical equipment, offering consultation services for business operations and management, undertaking investment and trading activities, and marketing cosmetic products. Notably, Kinsus is also involved in the production and sale of contact lenses. The company's primary customer base consists of manufacturers within the electronics industry.