Description

WenYi Trinity Technology Co., Ltd specializes in the design, manufacturing, and global distribution of semiconductor plastic packaging molds and associated equipment, serving both Chinese and international markets. The company offers a comprehensive range of products, including integrated circuit packaging molds, advanced automatic cutting and forming systems, chip packaging machines, robotic integration systems for chip packaging, sorting machines, and LED dispensers. Their portfolio also extends to precision spare parts crucial for semiconductor operations, alongside extrusion molds and various precision hardware components for general industrial applications. Beyond its core semiconductor focus, WenYi Trinity diversifies its offerings to include chemical building materials, a variety of plastic and color aluminum doors and windows, and automotive components such as metal stamping and injection molding products. Founded in 2000, the company initially operated as Tongling Zhongfa Sanjia Technology Co., Ltd before rebranding to WenYi Trinity Technology Co., Ltd in 2011. Its headquarters are situated in Tongling, in the People's Republic of China.