Aehr Test Systems (AEHR) NASDAQ

Currency In USD

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Aehr Test Systems

Address

400 Kato Terrace

Fremont, CA 94539

United States of America (the)

Phone

510 623 9400

Sector

Technology

Industry

Semiconductors

Employees

138

First IPO Date

August 15, 1997

Key Executives

NameTitlePayYear Born
Gayn EricksonPresident, Chief Executive Officer & Director571,0861964
Rhea J. PosedelFounder & Independent Chairman110,4711942
Donald RichmondChief Technology Officer198,7991956
Chris SiuChief Financial Officer, Executive Vice President of Finance & Secretary444,1051971
AdilChief Operating Officer446,2521977
Vernon RogersExecutive Vice President of Sales & Marketing470,6701967
Alberto SalamoneExecutive Vice President of Packaged Parts Burn-in Business704,5131973
Didier WimmersExecutive Vice President of Research & Development01962
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Description

Aehr Test Systems, founded in 1977 and based in Fremont, California, specializes in the global provision of advanced burn-in and test systems for integrated circuits, encompassing logic, optical, and memory devices. Its extensive product lineup includes the ABTS and FOX-P families of test and burn-in solutions, complemented by specialized components such as the FOX WaferPak Aligner, FOX-XP WaferPak Contactor, FOX DiePak Carrier, and FOX DiePak Loader. The ABTS system is specifically designed for both production and qualification assessments of packaged parts, covering a range of lower and higher power logic devices, as well as various memory types. For more complex integrated circuits like memories, digital signal processors, microprocessors, microcontrollers, systems-on-a-chip, and integrated optical devices, the FOX-XP and FOX-NP systems facilitate burn-in and functional testing at both the wafer and individual die/module levels. Aehr's FOX-CP system offers a compact, single-wafer solution for verifying the reliability of logic, memory, and photonic devices. A distinguishing offering, the WaferPak Contactor, features an exclusive full-wafer probe card, accommodating wafers up to 300mm, which enables semiconductor manufacturers to conduct comprehensive wafer-level testing and burn-in on Aehr's FOX platforms. Furthermore, the DiePak Carrier provides a reusable, temporary packaging medium, empowering IC manufacturers to complete final testing and burn-in processes for bare die and modules.

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