Aehr Test Systems (AEHR) NASDAQ
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Aehr Test Systems
Address
400 Kato Terrace
Fremont, CA 94539
United States of America (the)
Phone
510 623 9400
Website
Sector
Technology
Industry
Semiconductors
Employees
138
First IPO Date
August 15, 1997
Key Executives
| Name | Title | Pay | Year Born |
| Gayn Erickson | President, Chief Executive Officer & Director | 771,203 | 1964 |
| Rhea J. Posedel | Founder & Independent Chairman | 108,880 | 1942 |
| Donald Richmond | Chief Technology Officer | 198,799 | 1956 |
| Adil | Chief Operating Officer | 446,252 | 1977 |
| Vernon Rogers | Executive Vice President of Sales & Marketing | 470,670 | 1967 |
| Chris Siu | Chief Financial Officer, Executive Vice President of Finance & Secretary | 509,771 | 1971 |
| Alberto Salamone | Executive Vice President of Packaged Parts Burn-in Business | 0 | N/A |
| Didier Wimmers | Executive Vice President of Research & Development | 0 | N/A |
Description
Aehr Test Systems, founded in 1977 and based in Fremont, California, specializes in the global provision of advanced burn-in and test systems for integrated circuits, encompassing logic, optical, and memory devices. Its extensive product lineup includes the ABTS and FOX-P families of test and burn-in solutions, complemented by specialized components such as the FOX WaferPak Aligner, FOX-XP WaferPak Contactor, FOX DiePak Carrier, and FOX DiePak Loader. The ABTS system is specifically designed for both production and qualification assessments of packaged parts, covering a range of lower and higher power logic devices, as well as various memory types. For more complex integrated circuits like memories, digital signal processors, microprocessors, microcontrollers, systems-on-a-chip, and integrated optical devices, the FOX-XP and FOX-NP systems facilitate burn-in and functional testing at both the wafer and individual die/module levels. Aehr's FOX-CP system offers a compact, single-wafer solution for verifying the reliability of logic, memory, and photonic devices. A distinguishing offering, the WaferPak Contactor, features an exclusive full-wafer probe card, accommodating wafers up to 300mm, which enables semiconductor manufacturers to conduct comprehensive wafer-level testing and burn-in on Aehr's FOX platforms. Furthermore, the DiePak Carrier provides a reusable, temporary packaging medium, empowering IC manufacturers to complete final testing and burn-in processes for bare die and modules.