Address
400 Kato Terrace
Fremont, CA 94539
United States of America (the)
Phone
510 623 9400
Website
Sector
Technology
Industry
Semiconductors
Employees
115
First IPO Date
August 15, 1997
| Name | Title | Pay | Year Born |
| Gayn Erickson | President, Chief Executive Officer & Director | 771,203 | 1964 |
| Rhea J. Posedel | Founder & Independent Chairman | 108,880 | 1942 |
| Donald Richmond | Chief Technology Officer | 198,799 | 1956 |
| Adil | Chief Operating Officer | 446,252 | 1977 |
| Vernon Rogers | Executive Vice President of Sales & Marketing | 470,670 | 1967 |
| Chris Siu | Chief Financial Officer, Executive Vice President of Finance & Secretary | 509,771 | 1971 |
| Alberto Salamone | Executive Vice President of Packaged Parts Burn-in Business | 0 | N/A |
| Didier Wimmers | Executive Vice President of Research & Development | 0 | N/A |
Aehr Test Systems, founded in 1977 and based in Fremont, California, specializes in the global provision of advanced burn-in and test systems for integrated circuits, encompassing logic, optical, and memory devices. Its extensive product lineup includes the ABTS and FOX-P families of test and burn-in solutions, complemented by specialized components such as the FOX WaferPak Aligner, FOX-XP WaferPak Contactor, FOX DiePak Carrier, and FOX DiePak Loader. The ABTS system is specifically designed for both production and qualification assessments of packaged parts, covering a range of lower and higher power logic devices, as well as various memory types. For more complex integrated circuits like memories, digital signal processors, microprocessors, microcontrollers, systems-on-a-chip, and integrated optical devices, the FOX-XP and FOX-NP systems facilitate burn-in and functional testing at both the wafer and individual die/module levels. Aehr's FOX-CP system offers a compact, single-wafer solution for verifying the reliability of logic, memory, and photonic devices. A distinguishing offering, the WaferPak Contactor, features an exclusive full-wafer probe card, accommodating wafers up to 300mm, which enables semiconductor manufacturers to conduct comprehensive wafer-level testing and burn-in on Aehr's FOX platforms. Furthermore, the DiePak Carrier provides a reusable, temporary packaging medium, empowering IC manufacturers to complete final testing and burn-in processes for bare die and modules.