Amkor Technology, Inc. (AMKR) NASDAQ

Currency In USD

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Amkor Technology, Inc.

Address

2045 East Innovation Circle

Tempe, AZ 85284

United States of America (the)

Phone

480 821 5000

Sector

Technology

Industry

Semiconductors

Employees

28300

First IPO Date

May 01, 1998

Key Executives

NameTitlePayYear Born
Kevin EngelPresident, Chief Executive Officer & Director1.12M1973
John Don LiuExecutive Vice President, Corporate Development & Strategy98,5041968
Susan Y. KimChairman235,0011963
JinAn LeeExecutive Vice President of Worldwide Manufacturing560,509N/A
Mark N. RogersExecutive Vice President, General Counsel & Corporate Secretary1.11M1966
Farshad HaghighiExecutive Vice President & Chief Sales Officer1.13M1963
Megan FaustExecutive Vice President, Chief Financial Officer & Treasurer1.25M1974
Cherie BuntynSenior VP & Chief Accounting Officer01977
Jennifer JueVice President of Investor Relations & Finance0N/A
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Description

Amkor Technology, Inc. operates internationally, delivering external semiconductor packaging and testing solutions across North America, Japan, Europe, the Middle East, Africa, and the broader Asia Pacific region. Their comprehensive, end-to-end offerings encompass a range of processes, including semiconductor wafer bumping, probing, back-grinding, package conceptualization, final packaging, testing, and direct shipment services. The company's product portfolio features flip-chip scale packages, critical for devices like smartphones, tablets, and other portable consumer electronics. They also provide flip-chip stacked chip-scale packages, designed for layering memory atop digital basebands and as application processors in mobile units. Flip-chip ball grid array packages cater to diverse applications in networking, data storage, computing, and general consumer products. Wafer-level CSP packages find use in power management systems, transceivers, sensors, wireless charging technologies, codecs, radar systems, and specialized silicon components. Their wafer-level fan-out packages are integral for integrated circuits, alongside silicon wafer integrated fan-out technology, which offers a thinner alternative to traditional laminate substrates. Additionally, Amkor supplies lead frame packages, commonly employed in electronic devices requiring low to medium pin count analog and mixed-signal functionalities. Substrate-based wirebond packages facilitate the connection of a die to its substrate. Micro-electro-mechanical systems (MEMS) packages involve miniature mechanical and electromechanical components. Furthermore, their advanced system-in-package (SiP) modules are vital for a broad array of applications, including radio frequency and front-end modules, basebands, connectivity solutions, fingerprint sensors, display and touchscreen drivers, various sensors and MEMS, and NAND memory and solid-state drives. The company primarily serves a clientele comprising integrated device manufacturers, fabless semiconductor enterprises, original equipment manufacturers, and contract foundries. Established in 1968, Amkor Technology, Inc. maintains its corporate headquarters in Tempe, Arizona.

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