Address
3421 Hillview Ave
Palo Alto, CA 94304
United States of America (the)
Phone
650 427 6000
Website
Sector
Technology
Industry
Semiconductors
Employees
37000
First IPO Date
August 06, 2009
| Name | Title | Pay | Year Born |
| Hock E. Tan | President, Chief Executive Officer & Executive Director | 2.93M | 1952 |
| Kirsten Spears | Chief Financial Officer & Chief Accounting Officer | 1.03M | 1964 |
| Mark D. Brazeal | Chief Legal & Corporate Affairs Officer | 1.41M | 1968 |
| Charlie Kawwas | President of Semiconductor Solutions | 2.09M | 1971 |
| Frank Ostojic | Senior Vice President & GM of ASIC Products Division | 0 | N/A |
| Ji Yoo | Director of Investor Relations | 0 | N/A |
| Ram Velaga | Senior Vice President & GM of Core Switching Group | 0 | N/A |
| Rich Nelson | Senior Vice President & GM of Broadband Video Group | 0 | N/A |
| Jill Turner | Vice President of Human Resources | 0 | N/A |
| Alan Davidson | Chief Information Officer | 0 | N/A |
Broadcom Inc. is a prominent global technology enterprise focused on the innovation, development, and supply of advanced semiconductor solutions and critical infrastructure software. The company's headquarters are situated in San Jose, California, and it maintains a significant team of 19,000 full-time staff. Its operations are segmented into four primary divisions: Wired Infrastructure, Wireless Communications, Enterprise Storage, and Industrial & Other. Broadcom’s diverse product range is integrated into numerous end-user technologies, including enterprise and data center networking, residential internet solutions, digital television receivers, telecommunications apparatus, mobile phones, data center servers and storage architectures, industrial automation, alternative and power generation systems, and electronic display technologies. The company's product offerings extend from fundamental discrete components to intricate sub-systems incorporating various device categories. This also encompasses specialized firmware designed to facilitate interaction between analog and digital systems, alongside mechanical hardware engineered to connect with optoelectronic or capacitive sensing technologies.