Description

ChipMOS TECHNOLOGIES INC. conducts research, development, manufacturing, and global sales of advanced, highly integrated, and precise integrated circuits. Headquartered in Hsinchu, Taiwan, and founded in 1997, the company also provides essential back-end assembly and testing services across key international markets, including Taiwan, mainland China, Japan, and Singapore. Its operations are structured across various segments, encompassing Testing, Assembly, Bumping, and specialized Testing and Assembly for LCD, OLED, and other display panel driver semiconductors, in addition to other related business areas. ChipMOS offers a comprehensive suite of back-end services: for memory and logic/mixed-signal semiconductors, these include engineering tests, wafer probing, final testing, and package assembly utilizing leadframe and organic substrate technologies. For display panel driver semiconductors, such as those used in LCDs and OLEDs, the company delivers gold bumping, reel-to-reel assembly, and testing solutions. The integrated circuits and services provided by ChipMOS are integral to a wide array of products, spanning personal computers, graphics applications like game consoles, telecommunications equipment, mobile devices including cellular phones, tablets, and various consumer electronics, as well as automotive, industrial, and display panel sectors.